Smiths Expands HF SMT Attenuator Line with Exciting New Additions
Smiths Interconnect has expanded its high-frequency surface mount chip attenuator product line by introducing the TSX Wire Bondable Fixed Chip Attenuator Series.
The TSX WB2 Series meets the MIL-PRF-55342 standards and offers broadband performance up to 50 GHz. It also provides enhanced power handling in a compact 0404 wire bondable package.
