Capable of Mounting 60,000 Flip-Chip Dies Every Hour

ITEC’s ADAT3 XF TwinRevolve die bonder boasts the capability to handle up to 60,000 flip-chips per hour.

Rather than using the traditional method of forward, backward, up, and down linear movements, this new die bonder utilizes two rotating heads. These heads work seamlessly together to pick, flip, and place the die in one continuous motion. This innovative mechanism minimizes inertia and vibration, enabling high-speed operation without compromising accuracy. As a result, chipmakers now have the potential to switch their high-volume, wire-bonded products to more efficient flip-chip technologies.