Nexperia Introduces 22 New Planar Diodes in Sleek CFP3-HP Packages

Nexperia has just introduced 22 new planar Schottky diodes in CFP3-HP packaging, split evenly with 11 tailored for industrial use and 11 meeting AEC-Q101 automotive standards. These new diodes come as manufacturers increasingly shift from SMx-type packages to smaller CFP-packaged devices, particularly in the automotive sector.

Ideal for applications such as DC-DC conversion, freewheeling, reverse polarity protection, and OR-ing, these diodes offer great versatility. They come with reverse voltage ratings ranging from 30 to 100V and forward current ratings between 1 and 3A. The exposed heatsink in these diodes allows for excellent heat dissipation within a compact 3.7mm by 1.8mm by 0.9mm footprint.

“As the industry moves towards more compact packages like CFP, Nexperia is committed to leading this transition and driving packaging innovation,” said Frank Matschullat, product group manager at Nexperia. “Thanks to our significant investments in expanding our capacity, we are well-prepared to meet the growing demand for CFP-packaged products, exceeding market expectations for the next three years. These new diodes add to our already extensive lineup of over 270 CFP-packaged products.”

The diodes feature a unique copper clip design, which makes them perfect for efficient and space-saving designs. Currently, CFP packaging is used across various power diode technologies, including Nexperia’s Schottky and recovery rectifiers, and can even be applied to bipolar transistors.