Unleashing the Power to Attach 60,000 Flip-Chip Dies Per Hour

ITEC claims its ADAT3 XF TwinRevolve die-bonder can handle up to 60,000 flip-chips per hour. Unlike traditional die bonders that use linear motion, this new model has two rotating heads that pick, flip, and place the chips in a smooth, rapid sequence.

The company states, “This design minimizes inertia and vibration, maintaining accuracy at significantly increased speeds. It paves the way for chipmakers to shift their high-volume wire-bonded products to flip-chip technology efficiently.”